How to build a server-grade computer/system? - NETIO Technologies
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How to build a server-grade computer/system?

How to build a server-grade computer/system?

The backbone of 5G is high-speed connectivity and fast packet processing. The backbone of a server-grade computer/system is its module or computer-on-module, which offers a computing solution that can really enhance edge deceives as server nodes and become more than capable of handling the various information streams, increasing the power of Industry 4.0 technologies and IIoT implementations.
COM Express is the most common form factor in embedded computing, especially has dominated the high-end field for years. Now the arrival of COM-HPC is raising new questions for anyone evaluating their next high-end embedded project. “Is COM-HPC going to replace COM Express?” The answer is no. The specifications are designed to supplement each other. Since implementing a computer-on-module needs to invest in a carrier board as well. Should I switch to the new type? It is particularly relevant for developers who have so far relied on COM Express. In short, not everyone or every device in edge computing applications needs COM-HPC. If it is a “performance-hungry” application such as to embed artificial intelligence with deep learning or implement tactile Internet at the edge server level, COM-HPC would be a good choice to leverage the resource into performance.
However, we would like to provide a more thorough knowledge of how to assess and decide on a best-fit module.

How to build a server-grade computer/system?

What is COM-HPC? (Compared with COM Express Type 7)
It is like COM Express a computer-on-module standard for high-performance embedded computing, following on from COM Express 3.0. It promises considerably higher transmission performance, many more high-speed interfaces, and significantly faster network connections. While COM Express establishes this connection with 440 pins, the COM-HPC specification provides 800 pins. This doubles the maximum number of PCIe lanes from 32 for COM Express Type 7 to 64 or COM-HPC/Server.
Current COM Express modules (Type 7) at the edge server level offer a maximum of 10 Gbt Ethernet per signal pair. COM-HPC specifies 25 Gbit Ethernet and more. That’s why COM-HPC is better for fast up, down, and crosslinks in all directions. 
The significant changes to baseboard/carrier board design will relate to signal routing. With the COM-HPC, the PCIe-4.0 and 5.0 can be up to four times faster than PCIe-4.0, requiring careful routing to ensure signal integrity – and 4.0 and 5.0 cannot travel as far as previous versions. As to the material of the PCB, it has been FR-4 for many years which is sufficient for PCIe-3.0 COM Express modules. Achieving the best performance for COM-HPC will require changing to a base material with lower transmission loss such as Megtron-4 laminates. To ensure signal integrity, the design of connection and thermal would be crucial.
With the details of differences between COM Express (Type 7) & COM-HPC, when it comes to a telecom-related project, COM Express has a great future in existing performance-level applications. COM-HPC (High Performance Computing) plays the role to fulfill the upcoming compute-intensive applications. 
Netiotek has decades of experience in embedded computing. We know to integrate a system with a suitable Intel Core processor and the requirements & certification standards of a wild range of industries. Also, we supply solutions with identical board configurations for 7~15 years. We have helped our telecom industry customers to design products since Type 2 was released till now. Our sophisticated experience in baseboard/ carrier board development can help your product go to market quickly and economically.

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