COM Express

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Application

Features

Temperature -40 to 85°C

Support 1 GB DDR2 400 /533 SDRAM

2 x SATA

Size 70*70(mm)

1 x SSD

8 x USB2.0

We are partnering with ADLINK for COM Express Carrier Boards’ Design

SPEC

	Model Name	COM Express
General	Processor	6th Gen Intel Atom® Processor (formerly “Elkhart Lake”)
	Chipset	Integrated
	Memory	LPDDR4 soldered memory up to 4267 MT/s, IBECC/non-ECC up to 16GB
	Processor Graphics	Intel® Gen11 LP Graphics Core Architecture
	BIOS	AMI UEFI BIOS
	Ethernet	Intel® MAC and external PHY MaxLinear GPY series PHY (GPY 211/215)
I/O Interface	USB	6x USB 2.0 2x USB 3.0
	Audio	Intel® HD Audio integrated in SoC
	SATA	2x SATA 3.0 (6 Gbit/s)
	PCI Express	4 PCIe x1 Gen3(Can be configured to 1x4 / 2 x2 / 4 x1)
	Serial I/O	2x UART, 1x I²C, 1x SMBus, 1x LPC
Display	Display Interface	1x LVDS 1x DDI1-DP
Mechanical & Environment	Dimension	84 x 55mm
	Power Supply	Nominal : +12V DC Wide range : ATX: 4.75-20 V AT / ATX Mode
	Environment	Storage Temperature: –20°C to 80°C Operating Temperature: 0°C to 60°C

Description

The COM Express Type 10 module is intended for low power platforms (TDP 12W and below), such as handheld devices (smart battery) for industrial, medical, transportation, and controllers for outdoor applications. The COM Express Type 10 Mini (84 x 55 mm, credit card size) is capable of entry level processing with ultra-low power consumption, while supporting graphics and optimized I/O count for mobile applications.